Join Us
Join us to sense and connect the future with innovative sensor technology.
Structural Design Engineer (Campus Recruitment)
Responsibilities:
- Design structures for the company's robotic tactile sensor modules.
- Design DEMO structures for the company's strain sensor chips.
- Provide application structure design support and modifications for strain sensor chip customers.
- Optimize sensor application structures under various conditions.
- Responsible for 3D modeling and engineering drawing output for the company's chip products.
- Collaborate closely with simulation engineers to continuously optimize structures for tactile modules and strain sensor chip applications.
Requirements:
- Bachelor's degree or above in Mechanical Engineering or a related field.
- Must have design experience with structural parts using processes like injection molding, sheet metal, CNC, and 3D printing.
- Experience in designing and assembling transmission structures such as gears, worm gears, and cable drives.
- Knowledge of materials science, familiar with the basic properties and processing techniques of common metallic (e.g., alloy steel, aluminum alloy, stainless steel) and non-metallic materials (e.g., silicon, ceramics, plastics).
- Familiarity with the working principles of strain gauges, bonding processes, and their impact on measurement results is preferred.
Embedded Hardware Engineer (Campus Recruitment)
Responsibilities:
- Develop system applications for the company's chip products, including circuit and PCB design, fabrication, and soldering, and provide design details to relevant personnel for coordinated design efforts.
- Design and debug reference designs and verification platforms for the company's chip products.
- Conduct reliability testing for chip products and write test reports.
- Assist the marketing department with new product training and initial market promotion, as well as some custom product design for clients.
- Write and revise application manuals and other solution documents for the company's chip products.
- Conduct market analysis and research to update and optimize system application solutions for chip products.
Requirements:
- Bachelor's degree or above in Electrical, Communications, Automation, or Control-related fields.
- Familiar with chip testing and verification processes, and PCB design workflows.
- Experience with embedded software development is a plus.
- Experience in the IC or chip design industry is preferred.
- Detail-oriented, diligent, able to solve problems independently, and possess strong communication skills.
Analog IC Design Engineer (Campus Recruitment)
Responsibilities:
- Define analog/mixed-signal circuit architectures and assess feasibility based on module specifications.
- Design and simulate key circuit modules.
- Plan module circuit floorplans and guide layout engineers in layout design.
- Model the designed analog modules and cooperate in chip-level co-simulation.
- Assist in writing product technical documents and application manuals.
- Assist in developing chip testing and verification plans.
- Assist other departments in designing chip application solutions and resolving issues during chip production and application.
Requirements:
- Primarily for recent graduates with a Master's degree or higher in Microelectronics or related fields from 985/211 universities (candidates with extensive IC design experience may apply for senior positions).
- Solid theoretical knowledge and analytical skills in circuits, understanding of semiconductor processes and device physics; familiar with analog chip design flow, with experience in complete circuit design projects; knowledge of basic analog modules like opamp, LDO, Bandgap, AD/DA, PLL; proficient with EDA tools.
- Familiar with time-domain and frequency-domain analysis, with some understanding of noise theory. Experience in AD/DA design and a foundation in DSP is a plus.
- Good teamwork and professional ethics, strong learning and communication skills, self-motivated.
Structural Simulation Engineer (Campus Recruitment)
Responsibilities:
- Create parametric simulation models for the company's robotic tactile sensor modules.
- Create parametric simulation models for the company's strain sensor chips and customer application structures.
- Use finite element analysis software for static, impact, fatigue, and non-linear (e.g., large deformation) simulations.
- Participate in or lead the experimental validation of simulation results, calibrating and refining simulation models by comparing with test data to improve accuracy.
- Optimize sensor application structures under various conditions.
- Collaborate closely with chip design engineers to provide simulation data support and improvement suggestions for sensor chip design (wafer shape, strain area layout, force transmission structure).
- Collaborate closely with structural design engineers to provide simulation data support and improvement suggestions for sensor application structures.
- Experience in fluid simulation, thermal simulation, etc., is a plus.
Requirements:
- Bachelor's degree or above in Mechanics, Mechanical Engineering, or a related field.
- Must have simulation experience with sensors or precision measurement equipment related to pressure, stress, and strain.
- Proficient in at least one major finite element analysis software, capable of independently completing the entire process from geometry cleanup, meshing, boundary condition setting, solving, to post-processing.
- Understand key sensor performance metrics such as sensitivity, non-linearity, hysteresis, creep, and be able to analyze their causes from a simulation perspective.
- Knowledge of materials science, familiar with the mechanical properties and constitutive models of common metallic (e.g., alloy steel, aluminum alloy, stainless steel) and non-metallic materials (e.g., silicon, ceramics, plastics).
- Familiarity with the working principles of strain gauges, bonding processes, and their impact on measurement results is preferred.
Sales Manager (Suzhou)
Responsibilities:
- Promote and sell sensor chips to major application factories and end-brand manufacturers.
- Responsible for achieving company sales targets: develop sales and marketing plans based on performance indicators.
- Expand and manage various sales channels.
- Develop high-quality customer resources, manage and maintain customer relationships and long-term strategic cooperation plans, and manage customer sales forecasts, product delivery, and after-sales service.
- Gather information on the IC industry, end-brand manufacturers, and competitors; understand technological development trends to support company decision-making.
Requirements:
- Bachelor's degree or above, CET-4 or higher.
- 5+ years of sales experience in the electronic components industry and sensor chips; familiarity with sensor application markets such as wearables, consumer electronics, security, surveillance, and lighting is preferred.
- Good expression, communication skills, and customer service awareness; strong market development and sales skills.
- High integrity, strong execution, responsible, diligent, and a good team player with a desire for self-improvement.
Senior Digital Circuit Design Engineer
Responsibilities:
- Write HDL code.
- Perform RTL/pre-layout/post-layout verification to meet project logic verification needs.
- Conduct synthesis, timing analysis, and formal verification; perform SoC-level co-simulation with analog engineers.
- Develop test plans, generate test vectors for products, and debug test vectors with test engineers.
- Design FPGA prototypes and perform application-level verification of FPGA prototypes or chips with system engineers.
- Assist in writing product technical documents and application manuals.
- Assist other departments in designing chip application solutions and resolving issues during chip production and application.
Requirements:
- Master's degree in Microelectronics, Electronics, Communications, or a related field with 3+ years of experience, or Bachelor's degree with 5+ years of IC design experience, with successful tape-out experience.
- Familiar with digital circuit principles and IC design flow; proficient in front-end design languages like Verilog or VHDL; skilled in using EDA tools.
- Familiar with the design of common digital circuit modules such as State machine, Register bank, GPIO, I2C, SPI, UART, memory, and timing control.
- Experience with MCU, DSP, flash memory design, and knowledge of architectures like ARM or RISC-V is a plus.
- Good English reading and writing skills; strong sense of responsibility, meticulous; strong self-learning and problem-solving abilities, self-motivated.
- Design Manager: 3+ years of project and team management experience, with good communication and coordination skills, able to effectively manage and motivate a team to achieve maximum overall performance.
FAE (Field Application Engineer) (Suzhou)
Responsibilities:
- Assist sales with solution design during the product promotion phase.
- Facilitate the testing of samples/demos at the client's site.
- Provide technical support to assist sales in securing project design-ins at client sites.
- Offer technical services for product trial production and mass production at the client's site.
- Resolve various issues related to product application at the client's site.
- Conduct external technical training for engineering staff of distributors and end customers.
Qualifications:
- Bachelor's degree or above in Electronics, Microelectronics, or a related engineering field, with 5+ years of work experience.
- Familiar with the design principles and application techniques of basic analog and digital circuits, and hardware/software development related to microcontrollers; proficient with relevant development tools. Extensive hands-on experience in board-level circuit development, debugging, and troubleshooting.
- Familiarity with markets such as wearables, consumer electronics, security, surveillance, and lighting is a plus.
- Knowledge of electronic component specifications and applications, experience in circuit failure analysis, and strong problem-solving skills.
- Strong learning and promotional abilities, good teamwork and communication skills.
Senior Analog Circuit Designer
Responsibilities:
- Define analog/mixed-signal circuit architectures and determine module specifications based on system requirements and chip definitions.
- Design and simulate key circuit modules.
- Plan chip and module floorplans, and guide layout engineers in layout design.
- Integrate all chip modules, model analog modules, and cooperate in chip-level co-simulation.
- Assist in writing product technical documents and application manuals.
- Assist in developing chip testing and verification plans.
- Assist other departments in designing chip application solutions and resolving issues during chip production and application.
Requirements:
- Master's degree or higher in Microelectronics or a related field, with 3+ years of IC design experience and successful tape-outs.
- Familiar with semiconductor processes and device physics; proficient in circuit system principles and IC design flow; expert in designing modules such as opamp, LDO, Bandgap, CP, AD/DA, PLL; skilled in using EDA tools.
- Familiar with time-domain, frequency-domain, and phase-domain analysis, with a deep understanding of low-power design and noise control. Proficient in reading and writing English technical documents. Familiarity with sigma-delta design and a foundation in DSP is a plus.
- Good teamwork and professional ethics, strong learning and communication skills, self-motivated.
Compensation and Benefits
- 8-hour workday, 5-day work week, 8+ days of paid annual leave.
- Social insurance, housing fund, performance bonuses, and annual bonuses.
- The company values a human-centric management style and provides an excellent platform for self-realization.
- We offer an attractive equity incentive plan, aligning company growth with personal interests for significant potential returns.
We look forward to you joining us!
Please send your resume to the contact person below, and we will get in touch with you as soon as possible.